This technology represents a significant opportunity for industry to achieve cost savings compared to thick film techniques. It is faster and offers a production mechanism that reduces environmental impact. Brunel University is keen to license this technology for a wide range of applications.

This handbook has been designed to offer an introduction to the wide variety of potential applications of conductive lithographic films. This emering technology has been employed in systems ranging from electical interconnect and RF ID devices to flip-chip and display architectures. The research undertaken over the last four years, funded by EPSRC awards at Brunel University, has formed the foundation for a new technology that may, in the near future, supersede many thick film printing applications.

Journals
A Novel Circuit Fabrication Technique Using Offset Lithography, Journal of Electronics Manufacturing. (1997) Vol. 7, No. 1, pp 63 - 67.

A Novel Lithographic Technology for Microwave Integrated Circuits. I.E.E. Electronics Letters. (1997) Vol. 33, No. 6, March 1997. p 483.

Revolutionary Eco-Friendly Manufacturing Technique for PCBs. Engineering Designer (Journal of the Institute of Engineering Designers), (1998) Vol. 24, No. 3. pp 12 - 15.

Frequency Selective Filter Structures. I.E.E. Electronics Letters, (1999) Vol. 35 No. 4 Feb. 1999, p.306.

Characterisation of Offset Lithographic Films Using Microelectronic Test Structures. (1999) IEICE Transactions on Electronics. (Japan), E-82-C, No 4, pp 576-581, April 1999.

RF Circulator Structures via Off-Set Lithography. I.E.E. Electronics Letters, Vol 35 No 19, September 1999, p1634.

Interdigitated Capacitors by Offset Lithography, Journal of Electronics Manufacture. (Accepted 31/1/00)

Environmental Assessment of an Additive Circuit Fabrication Process. Journal of Cleaner Production. (Submitted)

Characterisation of Offset Lithographic Printing Press Parameters on Film Conductivity. Journal of Engineering Manufacture. (Submitted)

Publications in Preparation
Microwave Integrated Circuits Using Lithographic Films. I.E.E.E. Microwave & Guided Wave Letters. (In Preparation).

Electromigration in Conductive Lithographic Films. Journal of Materials Science: Materials in Electronics (in Preparation)

Mechanisms of Conduction in Conductive Lithographic Films. Journal of Materials Science: Materials in Electronics (In Preparation)

Conferences
Assessment of Conductive Lithographic Films for Microwave Applications. Automated R.F. and Microwave Measurement Society Conference. 31st October - 1st November 1996. Limpley Stoke, Bath, UK. (Prize Paper).

Assessment of the Environmental Impact of Conductive Lithographic Films. Engineering Management Conference, Loughborough, August 1997. pp 397 - 406. Conductive Lithographic Films - Novel Material Application for Electronics. Technology Foresight Workshop - Molecules, Materials and Markets. Royal Society of Chemistry. 7th January 1997. Bristol, UK.

Further Developments of Microwave CLFs. Automated R.F. and Microwave Measurement Society Conference. 7th - 8th April 1997. Malvern, UK.

Conductive Lithographic Films. IEEE International Symposium on Electronics and the Environment. 5th - 7th May 1997. San Francisco, California.

The Development of a Step Change Design Approach to Reduce Environmental Impact through Provision of Alternative Processes and Scenarios for Industrial Designers. Humane Village Congress. ICSID ‘97.

A Comparison of the Characteristics of Conductive Lithographic Films and Screen Printed Circuits. 11th Annual European Passive Components Conference (CARTS-Europe 97). 14th - 16th October 1997. Prague, Czech Republic.

Test Structures to Characterise a Novel Circuit Fabrication Technique That Uses Offset Lithography. IEEE International Conference on Microelectronic Test Structures. 23rd - 26th March 1998. Kanazawa, Japan.

A novel manufacturing process for capacitors , Eco Design 1999, Proceedings of 1st International Symposium on Environmentally Conscious Design and Inverse Manufacturing 1st Feb. 1999, Tokyo, Japan p842-848.

Component Attachment in Lithographic Film Circuits. Twenty - Fourth International Electronics Manufacturing Technology Symposium. 18th - 19th October 1999, Austin Convention Center, Austin, Texas, USA, pages 282-286.

Post - Processing of Conductive Lithographic Films for Electronic Interconnect. Twenty-Fourth International Electronics Manufacturing Technology Symposium. 18th - 19th October 1999, Austin Convention Center, Austin, Texas, USA, pages 287-293.

Lithographic Film Capacitors. Passive Components Trends and New Technology. 13th European Passive Components Conference CARTS ‘99, Lisbon, Portugal 18-22 October 1999, Pages 71-75.

Development of Paper Membrane Switches for fully featured computer keyboards. IEEE International Symposium on Electronics and the Environment 8-10 May 2000. San Francisco, USA

Patent Applications
Patent Application No. 97925195. Currently in International Phase.
Based upon UK patent Applications: 961227.6, 9620099.3 & 9621571.
Patent Application No. PCT/GB99/04064. Currently in International Phase.

VAT No: GB223518191

DATE PUBLISHED: April 2000
ISBN: 0-9538356-0-X

Copyright © Blue Ramsey, David Harrison, Darren Lochun, Peter Evans & Paul Harrey